Dispensing system with bypass

ABSTRACT

A chemical injection system connects a main water flow to a source of chemicals to a bypass chemical dispenser in a water treatment system. The chemical injection system includes a supply pipe, a return pipe having a bypass chemical dispenser located along a length thereof, and a controlled pumping system including a compounding-rate pump controller connected to a pumping loop.

CROSS REFERENCE TO RELATED APPLICATION

The present application claims the benefit of U.S. Provisional PatentApplication Ser. No. 63/084,729, entitled “DISPENSING SYSTEM WITHBYPASS,” filed Sep. 29, 2020, which is incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a chemical injection apparatus. Inparticular, the present invention relates to a water treatment systemwith a pressurized bypass chemical dispenser (or chemical reservoir) fortreating pressurized piping systems in buildings, where the chemicalinjection rate of the water treatment system is adjusted to beproportional to the flow rate in a supply pipe by means of a bypass loopand compounding pump controller. In accordance with such a system, thepump is supplemented by a secondary bypass to allow accurate adjustmentand rapid filling and flushing of the chemical reservoir when servicing.

2. Discussion of Related Art

Many commercial and residential water supplies suffer from objectionableconditions. Often, treatment measures are implemented with the additionof chemical treatments to the water supply, including for examplephosphate or silicate compounds. In order to provide effective treatmentand to prevent other problems from occurring, it may be necessary tocarefully meter the amount of chemical treatment agent to a givenquantity of supplied water.

There are specific advantages to the use of a dry powder or granularwater treatment chemical, typically comprising silicate and phosphatesalts. Some advantages include performance benefits, lower cost, andmore practical shipping and storage requirements which lead to savingnatural resources. In the case of blended phosphates commonly used forwater treatment, the products raw form after production is a dry solid,therefore, the use of the dry powder or granular product avoids the stepof having to dissolve the material in water. Again, using the dry powderor granular product for water treatment at the customer's locationeliminates the need to ship massive tonnages of water across thecountry, saving large amounts of money, shipping resources, and fuel.

An example of such a dispenser is disclosed in U.S. Pat. No. 3,266,870to Cianflone. The patent discloses a dispenser for forming a saturatedchemical solution in which fresh water entering a pot is uniformlydistributed in a manner decreasing the time required to produce auniform solution at the draw-off point. The dispenser improvescirculation of water that tends to reduce undissolved solids dispersedin the saturated solution, thereby eliminating the need for screens inthe outlet line from the feeder. The dispenser also provides improveduniformity in the saturated solution regardless of the level of the drychemical, thereby providing a more precisely controllable system forchemically treating water.

The present applicant has also designed chemical dispensing system, forexample, U.S. Pat. No. 6,902,668. This chemical dispensing systemincludes a dispenser head member and a chemical holding container forholding chemical. The dispenser head member has a flow entry means fordirecting fluid flow into the chemical holding container and a flow exitmeans for directing fluid flow out of the chemical holding container.The flow entry means is in fluid connection with a center-mounted,elongated perforated tubular member extending at least partway into thechemical holding container. The chemical holding container has anopening which is releasably engageable with the dispenser head memberfor refilling.

Practical experience has shown that the ability to draw off a uniformlysaturated solution from a chemical holding container with a solublesolid product collected at the bottom of the container is less reliableas the ratio of the diameter of the container to the length of thecontainer decreases. For example, the “pot” described by Cianflone isspherical in shape, which would have diameter to length ratio of 1.0. Anexample of a higher diameter to length ratio container would be acylindrically shaped container with a diameter of 12-inches and a lengthof 24-inches, which would have a diameter to length ratio of 0.5. Forthose skilled in the design, manufacture, and installation of this typeof water treatment system, a container (often called a “dispenser”) witha diameter to length ration of 0.5 has many advantages over aspherically shaped dispenser, including advantages of design,manufacture, and installation. A disadvantage of a lower diameter tolength ratio is the increasing difficulty of maintaining a sufficientlysaturated solution, and the tendency for the dispenser to stop feeding.The invention described in this application helps overcome thesedifficulties.

As shown above, there are various methods presently available for theinjection of chemicals into pressurized piping systems. These variousdesigns all have their benefits and shortcomings. The present inventionis designed to provide additional options for injecting water treatmentproducts into a pressurized water pipe, improve reliability, and providesafer treatment compared to other presently available alternatives, andis particularly important for the improvement in quality and costbenefits to the consumer.

BRIEF SUMMARY OF THE DISCLOSURE

The present invention is directed to an improved chemical dispensingapparatus, which may at least partially overcome the disadvantages ofexisting systems or provide the consumer with a useful or commercialchoice.

In a broad form, the invention resides in a fully pressurized chemicalinjection system that, while under pressure, is impervious tocontaminants from the surrounding ambient environment, and has thecapability to provide chemical injection into a remote pipeline that isproportional to the flow of liquid in the pipeline. In the preferredembodiment, the proportional chemical injection is achieved by using abypass loop, an electronic compounding pump controller, a pump, wherethe pump is supplemented by a secondary bypass to allow accurateadjustment and rapid filling and flushing of a chemical dispenser.

In one aspect the invention includes a chemical injection systemconnecting a main water flow to a source of chemicals to a bypasschemical dispenser in a water treatment system. The chemical injectionsystem includes a supply pipe, a return pipe having a bypass chemicaldispenser located along a length thereof, and a controlled pumpingsystem including a compounding-rate pump controller connected to apumping loop.

In some embodiments of the chemical injection system the pumping loopincludes a feed pump, a bypass circuit, in which a flow rate in thebypass circuit is controlled by a bypass valve, and a feed controlneedle valve.

In some embodiments of the chemical injection system the feed pumpincludes a solenoid pump, a centrifugal pump, or a positive displacementpump.

In some embodiments the chemical injection system includes a first flowcircuit between the bypass chemical dispenser and the remote waterpipeline and a second flow circuit appurtenant to the first flowcircuit, wherein a pump is installed within the second flow circuit.

In some embodiments of the chemical injection system the pumping loopincludes a feed pump, a bypass circuit, in which a flow rate in thebypass circuit is controlled by a bypass valve, and a feed controlneedle valve, and the feed control needle valve is installed after thefeed pump and within the second flow circuit to change flow rate withinthe first flow circuit.

In some embodiments the chemical injection system includes a flow sensorthat is used to electronically regulate a pumping rate of the pumpingloop.

In some embodiments of the chemical injection system thecompounding-rate pump controller is a programable electronic controllerwith self-compounding feed rate adjustment.

Other objects and advantages of the present invention will becomeapparent from the following detailed description when viewed inconjunction with the accompanying drawings, which set forth certainembodiments of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic showing a typical layout of an installed watertreatment system with a preferred embodiment of the chemical injectionsystem of the present invention.

FIG. 2 shows a more detailed layout of the chemical injection system ofthe present invention including an orifice plate type of flow measuringassembly.

FIG. 3 shows a pressurized dispenser and flow pattern of a dispenserthat is nearly full of water treatment chemical product.

FIG. 4 shows a pressurized dispenser and flow pattern of a dispenserthat is nearly empty of water treatment chemical product.

FIG. 5 shows the preferred layout of the faceplate of the invention.

FIG. 6 is an operational “flowchart” of the compounding-rate pumpcontroller.

DETAILED DESCRIPTION

The detailed embodiments of the present invention are disclosed herein.It should be understood, however, that the disclosed embodiments aremerely exemplary of the invention, which may be embodied in variousforms. Therefore, the details disclosed herein are not to be interpretedas limiting, but merely as a basis for teaching one skilled in the arthow to make and/or use the invention.

With reference to FIGS. 1 to 6, the chemical injection system 100 of thepresent invention, and its preferred features and functions areillustrated.

FIG. 1 shows an installed water treatment system with an embodiment ofthe chemical injection system 100, along with other ancillarycomponents. The first component in the piping scheme layout of the watertreatment system is the pipeline 1 itself with a main water flow 2 thatis to be treated with the chemical injection system 100. The chemicalinjection system 100 connects the main water flow 2 to a source ofchemicals in a pressurized bypass chemical dispenser 13. As such, thechemical injection system 100 generally includes a supply pipe 11, areturn pipe 12, and a controlled pumping system 102. The controlledpumping system 102 includes a compounding-rate pump controller 3connected to a pumping loop 4, which is shown as being enclosed in a boxmarked as pumping loop 4.

The pumping loop 4 includes a feed pump 5, a bypass circuit 6, in whichthe flow rate in the bypass circuit 6 is controlled by a bypass valve 7,and a feed control needle valve 8. In accordance with a disclosedembodiment, the feed pump 5 is a solenoid pump, although it isappreciated the feed pump may be a centrifugal pump, a positivedisplacement pump, or other types of pumps known to those skilled in theart.

The supply pipe 11 brings water from the pipeline 1 to an inlet conduit4 a of the pumping loop 4, while the return pipe 12 returns water fromoutlet conduit 4 b of the pumping loop 4 to the pipeline 1. Connectingthe inlet conduit 4 a to the outlet conduit 4 b are a primary conduit 4c and a bypass conduit 4 d, wherein the primary conduit 4 c and a bypassconduit 4 d branch off of the inlet conduit and merge back together atthe outlet conduit 4 b. As such, a continuous conduit defined by thesupply pipe 11, the return pipe 12, the inlet conduit 4 a, the bypassconduit 4 d, and the outlet conduit 4 b forms a first flow circuitbetween the bypass chemical dispenser 13 and the remote water pipeline1. A second continuous conduit forming a second flow circuit appurtenantto the first flow circuit is defined by the supply pipe 11, the returnpipe 12, the inlet conduit 4 a, the primary conduit 4 c, and the outletconduit 4 b. The feed pump 5 and the feed control needle valve 8 areinstalled within the second flow circuit, in particular, along theprimary conduit 4 c, while the bypass circuit 6 and the bypass valve 7are installed within the first flow circuit, in particular, along thebypass conduit 4 d.

Connected to the pipeline 1 are two piping taps, including a supply tap9 and a return tap 10. The supply tap 9 is fluidly connected to thepumping loop 4 by a supply pipe 11. In particular, the first end 11 a ofthe supply pipe 11 is fluidly connected to the supply tap 9, andultimately the main water flow 2, and the second end 1 lb of the supplypipe 11 is fluidly connected to the pumping loop 4. The return tap 10 isfluidly connected to the pumping loop 4 by a return pipe 12. Inparticular, the first end 12 a of the return pipe 12 is fluidlyconnected to the return tap 10, and ultimately the main water flow 2,and the second end 12 b of the return pipe 12 is fluidly connected tothe pumping loop 4. The bypass chemical dispenser 13 is located alongthe length of the return pipe 12 between the pumping loop 4 and thereturn tap 10. As such, the return pipe 12 includes a first return pipesegment 104 a extending between the pumping looping 4 and the inlet diptube 22 of the bypass chemical dispenser 13 and a second return pipesegment 104 b extending between the outlet port 23 of the bypasschemical dispenser 13 and the return tap 10.

Ancillary components shown in the embodiment shown in FIG. 1 include aflow sensor 14 and the associated wiring 15 between the flow sensor 14and the compounding-rate pump controller 3, and the associated wiring 15between the compounding-rate pump controller 3 and the feed pump 5 ofthe pumping loop 4. It is appreciated the flow sensors are well knownand a variety of flow sensors and/or flow meters may be used withoutdeparting from the spirit of the present invention. Further, and asdiscussed below, the compounding-rate pump controller 3 of the presentinvention can be used with or without a flow sensor (or flow meter). Forexample, the compounding-rate pump controller 3 may be used without aflow meter in applications where one can feed the proper amount ofproduct using a timer, in cases where one knows how much water isflowing at specific times. For example, the current compounding-ratepump controller 3 could be cycled on-off by a timer four times per day.

The embodiment as configured in FIG. 1 results in a flow pattern with acontrollable chemical dispensing rate where fluid from the main waterflow 2 enters the pumping loop 4 by means of the supply pipe 11 in thedirection of the arrow 16 then enters the bypass chemical dispenser 13through the return piping 12 in the direction of the bypass water flow17 and is reintroduced into the pipeline 1 at the return tap 10.

FIG. 2 shows an embodiment of the invention, with more detailed views ofthe components within the pumping loop 4 and the pipeline 1 shown inFIG. 1. In particular, an orifice plate 18 is installed in the pipeline1 with flanges 19, to produce a pressure differential relative to theflow in the pipeline 1. A pressure differential sensor 20 is alsoprovided in communication with the pipeline 1 to communicate data to thecompounding-rate pump controller 3. A purge valve 21 is shown located atthe highest point to vent air from the pressurized pumping loop 4.

FIG. 3 shows a pressurized dispenser and flow pattern of a bypasschemical dispenser 13 that is nearly full of water treatment chemicalproduct 25. It should be noted that the water treatment chemical product25 is typically added to the bypass chemical dispenser 13 as a drypowder or granular product, however, a liquid or gel chemical product ofhigher density could be used, where the liquid or gel of higher densitywould settle at the bottom of the bypass chemical dispenser 13 and feedinto solution in a similar manner as a dry powder or granular product.The bypass chemical dispenser 13 has an inlet dip tube 22 connected tothe first return piping segment 104 a, an outlet port 23 connected tothe second return piping segment 104 b, and a removable cap 24 thatallows the filling of the bypass chemical dispenser 13 with a watertreatment chemical product 25. In the example provided in FIG. 3, thewater treatment chemical product 25 is nearly filled to the top of thebypass chemical dispenser 13 to a nearly full level chemical surface 26.

It is noted here that the preferred water treatment chemical product 25that is used in the type of bypass chemical dispenser 13 shown in FIG. 3is a solid granular product, typically a blend of sodium phosphates, orsilicate, or other materials of higher density than the water of themain water flow 2 being treated. As such, the water treatment chemicalproduct 25 settles to the bottom of the bypass chemical dispenser 13. Inthe typical application, the water treatment chemical product 25conglomerates into a continuous solid chunk of mass with a nearly fullchemical surface 26 that gradually dissolves water treatment chemicalinto the bypass water flow 17.

As shown in FIG. 3, bypass water flow 17 enters the inlet dip tube 22 ofthe bypass chemical dispenser 13 via the first return piping segment 104a and exits the bypass chemical dispenser 13 through the outlet port 23to the second return piping segment 104 b. In accordance with theembodiment disclosed with reference to FIG. 3, and as will be discussedbelow in more detail, the inlet dip tube 22 includes a top dip tubeorifice 27, a middle dip tube orifice 28, and a lower dip tube orifice29, wherein the top dip tube orifice 27, the middle dip tube orifice 28,and the lower dip tube orifice 29 are all of the same size. In theexample of having a nearly full level chemical surface 26, the bypasswater flow 17 is only able to exit the inlet dip tube 22 at the fullyexposed top dip tube orifice 27 near the upper portion 22 a of the inletdip tube 22. This portion of the bypass water flow 17 exiting the topdip tube orifice 27 dissolves water treatment chemical product 25 at thenearly full level chemical surface 26 to form an upper saturatedchemical product 27′ that exits the outlet port 23 with the bypass waterflow 17.

Further shown in FIG. 3, some of the bypass water flow 17 that entersthe inlet dip tube 22 exits the inlet dip tube 22 at the partiallyexposed middle dip tube orifice 28 located at an intermediate position22 b below the upper portion 22 a of the inlet dip tube 22. This portionof the bypass water flow 17 exiting the middle dip tube orifice 28dissolves water treatment chemical product 25 at the nearly full levelchemical surface 26 to form a middle saturated chemical product 28′ thatexits the outlet port 23 with the bypass water flow 17. It isappreciated by those familiar with this type of equipment that theconcentration of the middle saturated chemical product 28′ will be ofhigher concentration than the upper saturated chemical product 27′.

As shown in FIG. 3, further down the inlet dip tube 22 in the lowerportion 22 c of the inlet dip tube 22 is the lower dip tube orifice 29that is fully encased in the solid chunk of water treatment chemicalproduct 25. In the example of a nearly full level chemical surface 26there will be no portion of the bypass water flow 17 exiting the lowerdip tube orifice 29. It is noted that the bottom end dip tube orifice 30of the inlet dip tube 22 is simply the open end 22 d of the hollow inletdip tube 22, and it is obvious that with the nearly full chemicalsurface 26 there would result in no flow out of the bottom end dip tubeorifice 30.

FIG. 4 shows the same basic dispensing and flow patterns as FIG. 3.However, FIG. 4 shows the flow patterns in an example of flow with abypass chemical dispenser 13 that is nearly empty of water treatmentchemical product 25, with a nearly empty chemical surface 31 occurringnear the bottom of the bypass chemical dispenser 13.

As shown in FIG. 4, bypass water flow 17 enters the inlet dip tube 22 ofthe bypass chemical dispenser 13 via the first return piping segment 104a and exits the bypass chemical dispenser 13 through the outlet port 23to the second return piping segment 104 b. In accordance with theembodiment disclosed with reference to FIG. 4, and as will be discussedbelow in more detail, the inlet dip tube 22 includes a modified top diptube orifice 27 x, a modified middle dip tube orifice 28 x, and amodified lower dip tube orifice 29 x, wherein the modified top dip tubeorifice 27 x, the modified middle dip tube orifice 28 x, and themodified lower dip tube orifice 29 x are of different sizes. In theexample of having a nearly empty level chemical surface 31, the bypasswater flow 17 is able to exit the inlet dip tube 22 at the all orifices,that is, the modified top dip tube orifice 27 x, the modified middle diptube orifice 28 x, and the modified lower dip tube orifice 29 x. It isnoted here that the modification in the embodiment shown in FIG. 4 is anincreasing orifice hole size, where modified top dip tube orifice 27 xhas a smallest orifice diameter, the modified middle dip tube orifice 28x has a slightly increased orifice diameter, and the modified lower diptube orifice 29 x has an increased orifice diameter respective of theprior described orifices. Since the disclosed embodiment employs abypass style dispenser system (where the whole treated water stream doesnot have to go through the dispenser), rather only a small amount ofwater to dissolve and reintroduce a saturated solution, the dip tubediameter can be as small as ⅜-inch diameter for a smaller dispenser of12-diameter, and up to ½-inch for dispensers up to 24-inch in diameter.The purpose of the modified dip tube orifices increasing in diameter asthey go lower in the bypass chemical dispenser 13 is to direct higherportion of bypass water flow 17 to the lower areas of the bypasschemical dispenser 13 thereby creating a more uniform concentration ofwater treatment chemical product 25 in the bypass water flow 17.

With reference to FIG. 4, with a nearly empty chemical surface 31occurring near the bottom of the bypass chemical dispenser 13, there isno solid water treatment chemical product 25 impeding the bypass waterflow 17 out of the modified top dip tube orifice 27 x, the modifiedmiddle dip tube orifice 28 x, the modified lower dip tube orifice 29 x,or the bottom end dip tube orifice 30 x. However, there is a noticeabledistance between the inlet dip tube 22 and the nearly empty chemicalsurface 31.

Continuing with FIG. 4, it is appreciated by those skilled in the use ofthis type of bypass chemical dispenser 13 that the condition of alowering chemical product level creates a situation where theconcentration of water treatment chemical product 25 in the bypass waterflow 17 continues to drop to lower concentrations as the level of solidchemical product 25 drops, illustrated as lowering concentration 29′ andfurther lowering concentration 30′, as the level of the chemicalproducts drops below the modified middle dip tube orifice 28 x, themodified lower dip tube orifice 29 x, or the bottom end dip tube orifice30 x, respectively. This lowering of chemical concentration of watertreatment chemical product 25 in the bypass water flow 17 leads to acondition where the performance of the bypass chemical dispenser 13becomes unacceptable.

In contrast to the dip tube disclosed with reference to the '870 patentdiscussed above, the dip tube disclosed in accordance with the presentinvention with reference to FIGS. 3 and 4 only goes about ⅓ of the waydown the tank of the bypass chemical dispenser 13 while the dip tubedisclosed in the '870 goes all the way to the bottom of the tank. It hasbeen found that if the dip tube is run down to the bottom of the tank itwill tend clog and the feed rate will decrease because of not enoughflow to the end of the long deep dip tube.

Further, it is noted that the '870 patent discloses a spherical tank.While it is appreciated such spherical tanks work best for small tanksabout 12 inches in diameter. However, spherical tanks are harder (moreexpensive) to make, cumbersome, and often don't fit well in the spacesallowed for equipment. As such, it is appreciated various tank shapesmay be used in the bypass chemical dispenser where functionality is notsignificantly negatively impacted.

With the use of the compounding-rate pump controller 3 (as discussedbelow in detail) it is possible to use bypass chemical dispenser withtanks having high length-to-diameter ratios (for example, a 12 inchdiameter tank that is 48 inches high), because it is possible togradually increase the pump rate to mix up the product toward thebottom. A bypass chemical dispenser with a tank of these dimensions isvery desirable, but in the past has been difficult to make the entiretank of product feed out.

To address the problem described above, where lowering of chemicalconcentration of water treatment chemical product 25 in the bypass waterflow 17 leads to a condition where the performance of the bypasschemical dispenser 13 becomes unacceptable, the compounding-rate pumpcontroller 3 is configured to increase the pumping rate of the feed pump5 of the pumping loop 4 to a preselected percentage rate increase over apreselected period of time. The front view of the compounding-rate pumpcontroller 3 is shown as FIG. 5.

The compounding-rate pump controller 3 may be programmed to operate invarious modes. For example, the compounding-rate pump controller 3 maybe programmed to operate in a flow meter mode. When operating in theflow meter mode the compounding-rate pump controller 3 is configuredwith a separate flow meter, for example, a flow sensor 14 as disclosedin FIG. 1, that electronically communicates to the compounding-rate pumpcontroller 3 the flowrate in the pipeline 1, and the compounding-ratepump controller 3 controls the feed pump 5 to pump according to whatvalues one sets. This communication is by means of the commonly used4-20 ma circuit, where the compounding-rate pump controller 3 isprogrammed to instruct the feed pump 5 to pump at a specified rate forthe lowest flow (usually, zero flow is set to 4 ma, and the pump rate isset to 0 hz) to the highest flow (usually, the highest flow would be setto 20 ma, and the pump rate would be set to a desired rate, say 20 hz).It should be appreciated that 20 hz means the feed pump 5, which is asolenoid pump in accordance with a disclosed embodiment, will “click” 20times per second, each “click” being the stroke of a piston, a positivedisplacement pump, that dispenses about 0.1 ml of fluid.

In the example described above, the “compounding” feature graduallyincreases the pump rate over a specified number of days. For example, ifone sets the compounding for 100% over 60 days, at the end of 30 days,4ma would still be 0 hz, but 20 ma would be 30 hz. At the end of 60days, 4 ma would still be 0 hz, but 20 ma would be 40 hz. At the end ofthe 60 day period, or any time before, when the system is serviced, theservice technician hits the “reset” command, and the cycle goes back today one, the 60 day cycle starts all over again.

The compounding-rate pump controller 3 may also be programmed to operatein a timer mode. That is, the compounding-rate pump controller 3 can beconfigured to operate solely based on an on-off timer that turns thefeed pump 5 on at an initial pump rate. In the timer mode, no flowsensor (or flow meter) is used. The compounding-rate pump controller 3has a maximum four time-zones to operate. Each time zone can beprogrammed to operate every day of the week, or selected days of theweek.

When the “compounding” feature is used, the initial pump rate isprogrammed into the compounding-rate pump controller 3 as the desiredpump rate for day one. For example, if the initial pump rate isprogrammed to be 10 hz, and the “compounding” feature is set for 100%over 60 days the “compounding” feature would gradually increase the pumprate over the next 60 days to double the initial pump rate setting. Forexample, at the end of 30 days the pumping rate would be 15 hz. At theend of 60 days, pumping rate would be 20 hz (a 100% increase from theinitial pump rate setting). At the end of the 60 day period, or any timebefore, when the system is serviced, the service technician hits the“reset” command, and the cycle goes back to day one, the 60 day cyclestarts all over again.

As an example of how the compounding-rate pump controller 3 works, whenthe bypass chemical dispenser 13 is newly filled and has the nearly fullchemical surface 26 condition, the pumping rate is set at 5 Hz for amain water flow 2 rate of 250 gallons per minute (gpm). With thecompounding-rate pump controller 3 one can program the feed pump 5 toincrease the pump rate 100% (to a rate of 10 Hz) over a period of 60days (when the next service call is scheduled). In this example, whenthe service technician arrives on the next service call, the pump ratewould have gradually increased, in a linear increase, between 5 hz and10 hz. The increase in pumping rate from 5 hz to 10 hz, or whatevercombination of pump rate increase and service period setting to oneskilled in the art of dispensing system performance, would have producedan gradual increase in the rate of the bypass water flow 17 in thebypass chemical dispenser 13, between the nearly full chemical surface26 condition and the nearly empty chemical surface 31 condition, toproduce a consistent chemical feed to the main water flow 2 and a fullyemptying out of the bypass chemical dispenser 13.

With reference to FIG. 6, an operational flowchart of thecompounding-rate pump controller 3 in accordance with a disclosedembodiment is provided. Installed in the correct physical configurationwith all components, the compounding-rate pump controller 3 is unlockedto allow the adjustment of settings through the input of apre-programmed unlock button sequence. The up and down buttons allow auser to cycle through the settings for observation and adjustment.

In practice, setting up the compounding-rate pump controller 3 involvesboth the physical installation of the device with connections to allappropriate components as well as the proper programming of the settingsof the compounding-rate pump controller 3. The compounding-rate pumpcontroller 3 must be fastened in the desired way in the installlocation. Power must be provided to the compounding-rate pump controller3. Powered on, the display of the compounding-rate pump controller 3will show a summary screen of relevant information such as thedate/time, pump status (running or not), flow rate in treated pipe (ifapplicable), etc. The operator can cycle through all programmablesettings using the up and down buttons on the faceplate of thecompounding-rate pump controller 3 to select next and previous settingsrespectively. To adjust a particular setting, the user must enteradjustment mode by inputting a button sequence using the controls. Uponinputting the unlock button sequence, the user will be able to cyclethrough the programmable functions as before, but also be able to adjustthe setting by pressing the enter button when viewing a particularsetting. An asterisk is shown on screen when the compounding-rate pumpcontroller 3 is in adjustment mode. When the settings of thecompounding-rate pump controller 3 are configured to the desire of theuser, a timeout will return the controller from adjustment mode.

In compliance with the statute, the invention has been described inlanguage more or less specific to structural or methodical features. Itis to be understood that the invention is not limited to specificfeatures shown or described since the means herein described comprisespreferred forms of putting the invention into effect. The invention is,therefore, claimed in any of its forms or modifications within theproper scope of the description and claims appropriately interpreted bythose skilled in the art.

1. A chemical injection system connecting a main water flow to a source of chemicals to a bypass chemical dispenser in a water treatment system, the chemical injection system comprising: a supply pipe; a return pipe having a bypass chemical dispenser located along a length thereof; and a controlled pumping system including a compounding-rate pump controller connected to a pumping loop.
 2. The chemical injection system according to claim 1, wherein the pumping loop includes a feed pump, a bypass circuit, in which a flow rate in the bypass circuit is controlled by a bypass valve, and a feed control needle valve.
 3. The chemical injection system according to claim 2, wherein the feed pump includes a solenoid pump, a centrifugal pump, or a positive displacement pump.
 4. The chemical injection system according to claim 1, further including a first flow circuit between the bypass chemical dispenser and the remote water pipeline and a second flow circuit appurtenant to the first flow circuit, wherein a pump is installed within the second flow circuit.
 5. The chemical injection system according to claim 1, wherein the pumping loop includes a feed pump, a bypass circuit, in which a flow rate in the bypass circuit is controlled by a bypass valve, and a feed control needle valve, and the feed control needle valve is installed after the feed pump and within the second flow circuit to change flow rate within the first flow circuit.
 6. The chemical injection system according to claim 1, further including a flow sensor that is used to electronically regulate a pumping rate of the pumping loop.
 7. The chemical injection system according to claim 1, wherein the compounding-rate pump controller is a programable electronic controller with self-compounding feed rate adjustment. 